Von Roll/John C Dolph Dolphon® CC-1115 Solventless VPI Epoxy Resin
MFR #:Dolphon® CC-1115
EIS #:PH21-Dolphon CC-1115
MFR #:Dolphon® CC-1115
EIS #:PH21-Dolphon CC-1115
Von Roll/John C Dolph Dolphon® CC-1115 Solventless VPI Epoxy Resin, Epoxy Base Type, 2,200 V/Mil (ASTM D 115) Dielectric Strength, >200 °F Flash Point, 15 - 23 min At 285 °F (140 °C), ASTM D 3056 Gel Time, 80 - 90 Shore D (ASTM D 2240) Hardness, 11000 – 17000 cps (At 1 rpm 77 °F (25 °C), ASTM D1475), 4000 - 6000 cps (At 10 rpm 77 °F (25 °C), ASTM D1475) Viscosity. - CC-1115 is a unique thixotropic epoxy resin for vacuum pressure impregnation of random wound motors and form wound coils.
$173.50
- $493.85
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Von Roll/John C Dolph Dolphon® CC-1115 Solventless VPI Epoxy Resin, Epoxy Base Type, 2,200 V/Mil (ASTM D 115) Dielectric Strength, >200 °F Flash Point, 15 - 23 min At 285 °F (140 °C), ASTM D 3056 Gel Time, 80 - 90 Shore D (ASTM D 2240) Hardness, 11000 – 17000 cps (At 1 rpm 77 °F (25 °C), ASTM D1475), 4000 - 6000 cps (At 10 rpm 77 °F (25 °C), ASTM D1475) Viscosity. - CC-1115 is a unique thixotropic epoxy resin for vacuum pressure impregnation of random wound motors and form wound coils.
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Container Size:
1 gal
Color:
Translucent
EIS Part #:
DOLCC1115G
$ / US gallon
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Attributes
Features
Applications
Attributes
General Information
Item NameVPI Epoxy Resin
Trade NameDolphon®
SeriesDolphon® CC-1115
General Features
Net Weight9.0 - 9.8 lb/gal
TypeSolventless
Design & Construction
Base TypeEpoxy
Performance Details
Gel Time15 min
Technical Details
Flash Point200 °F
Chemical Properties
Viscosity11000 cP
Electrical Properties
Dielectric Strength2200 V/mil
Physical Properties
Hardness80 - 90 Shore D (ASTM D2240)
Features
Excellent moisture resistance, pre-catalyzed
Excellent chemical resistance, High flash point
Good thermal shock properties, exceptional tank stability
Improves impregnation and reduces processing time without affecting resin stability
Thixotropic
Minimum drain during cure
Excellent appearance
2.5 - 3.0 thixotropic index
3 - 5 Mils/side (ASTM D 115) film build
50 lbs at 25 °C, 7 lbs at 150 °C helical coil bond strength
3.24 at 25 °C, 100 Hz (ASTM D-150) dielectric constant
0.023 at 25 °C, 100 Hz (ASTM D-150) dissipation factor
3.7 x 10^14 ohms (ASTM D 257) surface resistivity
2.74 x 10^16 ohm-cm (ASTM D 257) volume resistivity