Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin
MFR #:Dolphon® CB-1109
EIS #:PH21-Dolphon CB-1109
MFR #:Dolphon® CB-1109
EIS #:PH21-Dolphon CB-1109
Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin, Room Temperature Cure Type, 665 V/Mil Dielectric Strength, 180% Elongation, 24 hr Full Cure Time, 1100+/-20 g/Liter At 25 °C Specific Gravity, 300 psi Tensile Strength, 0.33/0.36 W/mK Thermal Conductivity, 4500/8500 cps Viscosity. - CB-1109 is a unique, flexible resin. an alternative to silicone, urethane and epoxy resins, it can be used for potting, casting and coating electrical and electronic device applications where flexibility is required.
$44.80
- $59.64
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Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin, Room Temperature Cure Type, 665 V/Mil Dielectric Strength, 180% Elongation, 24 hr Full Cure Time, 1100+/-20 g/Liter At 25 °C Specific Gravity, 300 psi Tensile Strength, 0.33/0.36 W/mK Thermal Conductivity, 4500/8500 cps Viscosity. - CB-1109 is a unique, flexible resin. an alternative to silicone, urethane and epoxy resins, it can be used for potting, casting and coating electrical and electronic device applications where flexibility is required.
Product Options
Showing 2 out of 2 options
 | Container Size: 1 gal | EIS Part #: DOLCB1109G | $ / US pound | |
| Container Size: 5 gal | EIS Part #: DOLCB110945LB | $ / US pound |
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameFlexible Polybutadiene Resin
Trade NameDolphon®
SeriesDolphon® CB-1109
General Features
TypeTwo-Part
Design & Construction
ColorBlack
Cure TypeRoom Temperature
Performance Details
Tensile Strength300 psi
Full Cure Time24 hr
Thermal Conductivity0.33 W/mK
Chemical Properties
Specific Gravity1100 g/L
Viscosity4500 cP
Electrical Properties
Dielectric Strength665 V/mil
Physical Properties
Elongation180%
Features
- Remains flexible at temps from -72 to 200 °C
- Thermal shock resistance - passes over 30 cycles (olyphant washer test)
- Hydrolytically stable (100 °C @ 95% RH)
- Very low moisture vapor transmission
- Excellent electrical properties - minimal change throughout temperature range
- Repairable
- Low shrinkage, low embedment stress
- Easy mix and pour (hand or automatic dispensing)
- Room temperature cure (thick sections or thin layers) - can be used as stress relief layer
- Low viscosity
- Excellent adhesion properties
- Excellent chemical and abrasion resistance - resists degreaser solvent, very low exotherm
- 14 PLI tear strength
- -72 °C low temperature flexibility
- 6.1 x 10^-5 Inch/Inch/°C thermal expansion
- Viscosity: 4500 - 8500 cP
Applications
- Modules
- Sensors
- Relays
- Coils
- Ferrite Cores
- Transformers
- Amplifiers
- Power Supplies
- Ground Fault Interrupters
- Complete Electronic Assemblies
- Connectors
- Junction Boxes
- Splice Filling
- Cable Repair
- Motors