MFR #:Dolphon® CR-1050
EIS #:PH21-Dolphon CR-1050
MFR #:Dolphon® CR-1050
EIS #:PH21-Dolphon CR-1050
Von Roll/John C Dolph Dolphon® CR-1050 Epoxy Potting And Casting Resin Kit, Epoxy Base Type, 10.9 - 11.2 lb/gal At 77 °F (25 °C) Density, 410 V/Mil (1/8 Inch Specimen, ASTM D-149) Dielectric Strength, 14000 psi (ASTM D790) Flexural Strength, 75 Shore D (After 7 Days At Room Temperature Cure) Hardness, 100 (Part By Weight) Mixing Ratio, 8500 psi (ASTM D638) Tensile Strength, 6 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity, 8000 - 14000 cps At 77 °F Viscosity. - CR-1050 is a general purpose, red epoxy resin especially formulated for potting, casting, circuit boards and electronic assemblies.
$32.28
- $45.84
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Von Roll/John C Dolph Dolphon® CR-1050 Epoxy Potting And Casting Resin Kit, Epoxy Base Type, 10.9 - 11.2 lb/gal At 77 °F (25 °C) Density, 410 V/Mil (1/8 Inch Specimen, ASTM D-149) Dielectric Strength, 14000 psi (ASTM D790) Flexural Strength, 75 Shore D (After 7 Days At Room Temperature Cure) Hardness, 100 (Part By Weight) Mixing Ratio, 8500 psi (ASTM D638) Tensile Strength, 6 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity, 8000 - 14000 cps At 77 °F Viscosity. - CR-1050 is a general purpose, red epoxy resin especially formulated for potting, casting, circuit boards and electronic assemblies.
Product Options
Showing 2 out of 2 options
Container Size: 10 lb | EIS Part #: DOLCR1050G | $ / US pound | ||
Container Size: 50 lb | EIS Part #: DOLCR10505G | $ / US pound |
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameEpoxy Potting and Casting Resin Kit
Trade NameDolphon®
SeriesDolphon® CR-1050
Design & Construction
Base TypeEpoxy
ColorRed
Performance Details
Tensile Strength8500 psi
Flexural Strength14000 psi
Chemical Properties
Mixing Ratio100 (Part By Weight)
Viscosity8000 cP
Electrical Properties
Dielectric Strength410 V/mil
Physical Properties
Hardness75 Shore D (After 7 Days at Room Temperature Cure)
Features
- Supplied in one, two, eight and fifty pound kits
- Excellent dielectric properties
- Superior physical properties
- Good thermal conductivity
- Excellent penetration
- Machinable, can be drilled, tapped and shaped
- Glossy red appearance
- Low shrinkage
- 18,500 psi (ASTM D-695) compressive strength
- 0.3% (ASTM D-570) water absorption
- 0.2 gms/ft^2/24 hrs/in thickness (at 100 °F, 95% R.H.) moisture vapor transmission
- 6.34 x 10^-5 inch/inch/°C (ASTM D-696) coefficient of linear thermal expansion
- 5.0 x 10^12 ohms surface resistivity
- 6 x 10^13 ohm-cm volume resistivity
- 3.75 at 23 °C, 60 Hz (ASTM D-150) dielectric constant
- Dielectric Strength: 410 V/Mil (1/8 Inch Specimen, ASTM D-149)
- Viscosity: 8000 - 14000 cps at 77 °F
- Density: 10.9 - 11.2 lb/gal at 77 °F (25 °C)
- Flexural Strength: 14000 psi (ASTM D790)
- Tensile Strength: 8500 psi (ASTM D638)
- Viscosity: 8000 - 14000 cP
Applications
- Printed Circuit Boards
- Capacitors
- Ground Fault Interrupters
- Hybrid Circuits
- Electronic Ballasts
- Coils and Relays
- Sensors
- Motors
- Transformers