Von Roll/John C Dolph Dolphon® CB-1057 Epoxy Buttering Resin Reactor Kit
MFR #:Dolphon® CB-1057
EIS #:PH21-Dolphon CB-1057
MFR #:Dolphon® CB-1057
EIS #:PH21-Dolphon CB-1057
Von Roll/John C Dolph Dolphon® CB-1057 Epoxy Buttering Resin Reactor Kit, Epoxy Base Type, Room Temperature Cure Type, 430 V/Mil Dielectric Strength, 70 - 75 Shore D Hardness, 8100 psi Tensile Strength, 8 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity. - Dolphon CB-1057 is a flexible, two package, room temperature curing epoxy resin specifically formulated for encapsulation by buttering of electric motor.
$95.94
- $489.35
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Von Roll/John C Dolph Dolphon® CB-1057 Epoxy Buttering Resin Reactor Kit, Epoxy Base Type, Room Temperature Cure Type, 430 V/Mil Dielectric Strength, 70 - 75 Shore D Hardness, 8100 psi Tensile Strength, 8 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity. - Dolphon CB-1057 is a flexible, two package, room temperature curing epoxy resin specifically formulated for encapsulation by buttering of electric motor.
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Container Size:
1 lb
EIS Part #:
DOLCB1057LB
$ / each
Container Size:
8 lb
EIS Part #:
DOLCB10578LB
$ / Kit
Container Size:
2 lb
EIS Part #:
DOLCB10572LB
$ / Kit
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Attributes
Features
Attributes
General Information
Item NameEpoxy Buttering Resin Reactor Kit
Trade NameDolphon®
SeriesDolphon® CB-1057
Design & Construction
Base TypeEpoxy
ColorBlack
Cure TypeRoom Temperature
Performance Details
Tensile Strength8100 psi
Electrical Properties
Dielectric Strength430 V/mil
Physical Properties
Hardness70 - 75 Shore D
Features
Supplied in kit form for easy measuring of resin and reactor
Different color of resin and reactor insures through mixing
Cures quickly at room temperature
Tough and rubbery film, withstands severe mechanical and thermal shock
Thixotropic consistency, will not sag
Excellent abrasion, moisture and chemical resistance
0.085% water absorption
5.0 x 10^12 ohms surface resistivity
1.1 x 10^14 Ohm-cm volume resistivity
Thermal Conductivity: 8 x 10^-4 Cal/sec/cm^2/°C/cm