JNJ Industries UnderStencil SmartWipes are designed especially for cleaning SMT stencils and screen/stencil printing machines. This wipe effectively absorbs solder paste, flux residue, inks and epoxies, with or without solvent. The 401 wipe will keep stencil undersides clean from excess residue in between prints to prevent solder paste contamination on PC boards. Ideal for cleaning standard pitch, fine pitch, and ultra fine pitch stencil images, they resist tearing and shredding, and are very low in lint. - When used with JNJ SMT Stencil Cleaner solvent, it is the most effective stencil cleaning system available. UnderStencil is a hydroentangled blend of 55% cellulose / 45% polyester wipe that can be used in a variety of manufacturing applications and cleaning processes. A multipurpose, micro-level cleaning material, made from DuPont Sontara, that is specifically engineered for cleanroom applications.