MG Chemicals 860-60G Silicone Heat Transfer Compound, 60 g
MFR #:860-60G
EIS #:860-60G
MFR #:860-60G
EIS #:860-60G
Available to Order
Min Qty:1
|Qty Increment:1
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
$20.60 / Piece
Min Qty:1
|Qty Increment:1
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameHeat Transfer Compound
Trade NameMG Chemicals
Series860
General Features
Net Weight60 g
Design & Construction
ColorWhite
FormPaste
Performance Details
Adhesive StrengthMedium
Heat ResistanceYes
Physical Properties
Container TypeJar
Supporting Information
Use WithCPUs, GPUs, LEDs, Motors
Features
- High thermal conductivity (0.7 W/m·K)
- High dielectric strength
- Non-electrically conductive
- Excellent corrosion resistance
- Non-bleeding
Applications
- Thermal management
- Heat dissipation for CPUs, GPUs, LEDs