MG Chemicals 860-3.78L Silicone Heat Transfer Compound, 3.78 L
- MFR #:860-3.78L
- EIS #:860-3.78L
- MFR #:860-3.78L
- EIS #:860-3.78L
Ships From Vendor
Min Qty:1
|Qty Increment:1
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
$623.93 / Pail
Min Qty:1
|Qty Increment:1
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameHeat Transfer Compound
Trade NameMG Chemicals
Series860
General Features
Net Weight9.07 kg
Design & Construction
ColorWhite
FormPaste
Performance Details
Adhesive StrengthMedium
Heat ResistanceYes
Physical Properties
Container TypePail
Supporting Information
Use WithCPUs, GPUs, LEDs, Motors
Features
- High thermal conductivity (0.7 W/m·K)
- High dielectric strength
- Non-electrically conductive
- Excellent corrosion resistance
- Non-bleeding
Applications
- Thermal management
- Heat dissipation for CPUs, GPUs, LEDs