Loctite 384 Thermal Adhesive, 25mL Syringe, White, MFR ID 230184
- MFR #:230184
- EIS #:LOC20286
- Series #:384-TA
- MFR #:230184
- EIS #:LOC20286
- Series #:384-TA
Available to Order
Min Qty:1
|Qty Increment:1
Loctite 384 Thermal Adhesive. LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. It should be limited to a maximum of 500 V in high pot applications.
$115.40 / Piece
Min Qty:1
|Qty Increment:1
Loctite 384 Thermal Adhesive. LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. It should be limited to a maximum of 500 V in high pot applications.
- Attributes
- Applications
Attributes
General Information
Item NameThermal Adhesive
Trade NameHenkel
SeriesLOC-384-TA
General Features
StandardsRoHS Compliant
Shelf Life9 Months
Storage Temperature2 to 8 °C
Design & Construction
ColorWhite
Cure TypeRoom Temperature
FormPaste
Performance Details
Full Cure Time4 - 24 hr at 20 °C
Shear Strength750 psi
Tensile Strength1800 psi
Chemical Properties
CompositionModified Acrylic
Specific Gravity1
Viscosity100000 cP
VOC266g/L
Electrical Properties
Dielectric Strength26.7kV/mm
Physical Properties
Container Size25mL
Container TypeSyringe
Elongation0.9%
Odor/ScentMild
Environmental Condition
Temperature Rating-40 to 250 °F
Applications
- For Bonding Transformers, Transistors and Other Heat Generating Electronic Components to Printed Circuit Board Assemblies or Heat Sinks