Loctite 3627 Chipbonder® One-Part Surface Mount Adhesive, MFR ID LOC-3627
- MFR #LOC-3627
- EIS #PH11-LOC-3627
- Series #LOC-3627
$120.57 - $622.26
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Loctite 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - The product is also suitable for stencil print applications. Loctite 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
Features
- Fast cure formula
- High wet strength
- Dek Pro-Flow compatible
- Lead-free compatible
Applications
- For the Bonding of Surface Mounted Devices to Printed Circuit Boards Prior to Wave Soldering
General Information
| Item Name | Surface Mount Adhesive |
| Trade Name | Chipbonder® |
| Series | LOC-3627 |
General Features
| Type | One-Part |
| Storage Temperature | 2 to 8 °C |
Design & Construction
| Color | Red |
| Cure Type | Heat Cure |
| Form | Liquid, Paste |
Performance Details
| Full Cure Time | 90 sec at 150 °C |
Chemical Properties
| Composition | Epoxy |
| Specific Gravity | 1.353 |
| Viscosity | 2 - 5 Pa at 25 °C |
Physical Properties
| Density | 1.16g/cc |
| Odor/Scent | Characteristic |
Documents
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