MFR #:LOC-3621
EIS #:PH11-LOC-3621
Series #:LOC-3621
MFR #:LOC-3621
EIS #:PH11-LOC-3621
Series #:LOC-3621
Loctite 3621 surface mount adhesive is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required. - Particularly suited where dispense speeds greater than 35000 dots/hr are required. Loctite 3621 has been used successfully in lead free processes with water and alcohol based fluxes.
$95.06
- $136.56
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Loctite 3621 surface mount adhesive is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required. - Particularly suited where dispense speeds greater than 35000 dots/hr are required. Loctite 3621 has been used successfully in lead free processes with water and alcohol based fluxes.
Product Options
Showing 4 out of 4 options
Container Type: Fuji Syringe | Container Size: 30mL | EIS Part #: LOC30849 | $ / Piece | ||
Container Type: Panasonic Syringe | Container Size: 20mL | EIS Part #: LOC30848 | $ / Piece | ||
Container Type: Syringe | Container Size: 30mL | EIS Part #: LOC30847 | $ / each Pack: 10/Case | ||
Container Type: STD Syringe | Container Size: 10mL | EIS Part #: LOC30846 | $ / Piece |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®
SeriesLOC-3621
General Features
Shelf Life10 Months
Storage Temperature2 to 8 °C
TypeOne-Part
Design & Construction
ColorRed
Cure TypeHeat Cure
FormPaste
Performance Details
Full Cure Time90 sec at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity0.95
Viscosity0.5 - 3 Pas at 25 °C
VOC54.67g/L
Electrical Properties
Dielectric Strength40kV/mm
Physical Properties
Density1.16g/cc
Odor/ScentEpoxy
Supporting Information
Application MethodSyringe
Features
- Fast cure formula
- High wet strength
- Stable for 30 days at room temperature
- Lead-free compatible
Applications
- For the Bonding of Surface Mounted Devices to Printed Circuit Boards Prior to Wave Soldering