Loctite 3621 Chipbonder® One-Part Surface Mount Adhesive, MFR ID LOC-3621
MFR #:LOC-3621
EIS #:PH11-LOC-3621
Series #:LOC-3621
MFR #:LOC-3621
EIS #:PH11-LOC-3621
Series #:LOC-3621
Loctite 3621 surface mount adhesive is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required. - Particularly suited where dispense speeds greater than 35000 dots/hr are required. Loctite 3621 has been used successfully in lead free processes with water and alcohol based fluxes.
$100.50
- $144.37
Select from the options below
Loctite 3621 surface mount adhesive is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required. - Particularly suited where dispense speeds greater than 35000 dots/hr are required. Loctite 3621 has been used successfully in lead free processes with water and alcohol based fluxes.
Product Options
Showing 4 out of 4 options
Page 1 of 1
more info
Container Type:
Fuji Syringe
Container Size:
30mL
EIS Part #:
LOC30849
$ / Piece
Container Type:
Panasonic Syringe
Container Size:
20mL
EIS Part #:
LOC30848
$ / Piece
Container Type:
Syringe
Container Size:
30mL
EIS Part #:
LOC30847
$ / each
Pack: 10/Case
Container Type:
STD Syringe
Container Size:
10mL
EIS Part #:
LOC30846
$ / Piece
Page 1 of 1
more info
Attributes
Features
Applications
Attributes
General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®
SeriesLOC-3621
General Features
TypeOne-Part
Shelf Life10 Months
Storage Temperature2 to 8 °C
Design & Construction
ColorRed
Cure TypeHeat Cure
FormPaste
Performance Details
Full Cure Time90 sec at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity0.95
Viscosity0.5 - 3 Pas at 25 °C
VOC54.67g/L
Electrical Properties
Dielectric Strength40kV/mm
Physical Properties
Density1.16g/cc
Odor/ScentEpoxy
Supporting Information
Application MethodSyringe
Features
Fast cure formula
High wet strength
Stable for 30 days at room temperature
Lead-free compatible
Applications
For the Bonding of Surface Mounted Devices to Printed Circuit Boards Prior to Wave Soldering