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| Stock Status | ||||
|---|---|---|---|---|
| 10mL | EFD Syringe | $ / each | ||
| 20mL | Syringe | $ / each |
Loctite 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - Loctite 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the environmental resistance section.
Features
- One-component requires no mixing and is heat cure
- Medium dispense speed of 15000 - 25000 dots/hr
- Good green strength
- Red for best vision pickup on light surfaces
- Particularly suited where high speed, high dot profile, high wet strength and high electrical specifications are required
- Peaked dot profile
Applications
- For Small Parts Bonding
General Information
| Item Name | Surface Mount Adhesive |
| Trade Name | Chipbonder® |
| Series | LOC-3609 |
General Features
| Type | One-Part |
| Shelf Life | 6 Months |
| Storage Temperature | 2 to 8 °C |
Design & Construction
| Color | Red, Orange |
| Cure Type | Heat Cure |
| Form | Liquid |
Performance Details
| Full Cure Time | 90 sec at 150 °C |
| Shear Strength | 1450 psi at 150 °C |
Chemical Properties
| Composition | Epoxy |
| Specific Gravity | 1.1 |
| VOC | 2.46g/L |
Electrical Properties
| Dielectric Strength | See TDS |
Physical Properties
| Odor/Scent | Mild Petroleum |
Supporting Information
| Application Method | High Speed Syringe Dispensing |
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