Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. - Dow Corning silicone encapsulant requires no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.