EIS #:DC184X20.4KG-CA
Series #:184P
EIS #:DC184X20.4KG-CA
Series #:184P
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Min Qty:1
|Qty Increment:1
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Dow Corning brand silicone 10 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. - Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning. Sylgard 184 silicone elastomer is suitable for LED lighting encapsulation, industrial controls, high voltage resistor packs.
Requires Quote / Pail
Min Qty:1
|Qty Increment:1
more info
Dow Corning brand silicone 10 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. - Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning. Sylgard 184 silicone elastomer is suitable for LED lighting encapsulation, industrial controls, high voltage resistor packs.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSilicone Elastomer
Trade NameSylgard®
Series184P
General Features
Shelf Life720 Days
StandardsWEEE/RoHS Compliant
Design & Construction
ColorColorless
Cure TypeRoom Temperature/Heat Cure
FormLiquid
Chemical Properties
CompositionSilicone Resin
Specific Gravity1.03
Viscosity110 cSt
Physical Properties
Container Size45 lb
Container TypePail
Hardness43 Shore A
Odor/ScentSlight
Features
- Flowable
- Room temperature and heat cure
- Good dielectric properties
- Rapid, versatile cure processing controlled by temperature
- High transparency allows easy inspection of components
Applications
- For Power Supplies, Connectors, Sensors, Industrial Controls, Transformers, Amplifiers, High Voltage Resistor Packs, Relays, Adhesive/Encapsulant for Solar Cells, Adhesive Handling Beam Lead Integrated Circuits During Processing