Dow Corning Sylgard 577 two-part heat cure (addition-curing) adhesives cure rate is rapidly accelerated with heat (see cure schedules in table) and an optimum cure schedule will balance processing performance and costs. - For thicker sections or if voiding is observed the use of a 30-minute precure at 158 °F or the use of an adhesive with low-void technology may reduce voids.
$163.41
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Dow Corning Sylgard 577 two-part heat cure (addition-curing) adhesives cure rate is rapidly accelerated with heat (see cure schedules in table) and an optimum cure schedule will balance processing performance and costs. - For thicker sections or if voiding is observed the use of a 30-minute precure at 158 °F or the use of an adhesive with low-void technology may reduce voids.
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Container Size:
5kg
EIS Part #:
DC577X5KG
$ / Kit
Container Size:
0.5kg
EIS Part #:
DC577X.5KG
$ / Kit
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Attributes
Features
Applications
Attributes
General Information
Item NameSilicone Adhesive
Trade NameSylgard®
Series577
General Features
TypeTwo-Part, Primerless
StandardsUL Listed, MIL PRF-23586F Certified, WEEE/RoHS Compliant
Design & Construction
Color - Part-ABeige
Color - Part-BBlack
Cure TypeHeat Cure
Form - Part-ALiquid
Form - Part-BLiquid
Physical Properties
Container TypeKit
Hardness60 Shore A
Features
Flowable
Heat cure
High tensile strength
Long working time after mixing
Rapid, versatile cure processing controlled by temperature
Able to flow, fill or self-leveling after dispensing
Long working time reduces need for equipment purging/clean-up
Can be considered for uses requiring added flame resistance
Applications
For Sealing Lids and Housings, Attaching Baseplates, Gasketing, Connector Sealing