MFR #:195733
EIS #:LOC21087
Series #:384-KT
MFR #:195733
EIS #:LOC21087
Series #:384-KT
Out of Stock
Min Qty:1
|Qty Increment:1
Pack:10/Carton
more info
Loctite 384 ODC Free Repairable Kit. For bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks. LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. It should be limited to a maximum of 500 V in high pot applications.
$152.31 / Kit
Pack: 10/Carton
Min Qty:1
|Qty Increment:1
Pack:10/Carton
more info
Loctite 384 ODC Free Repairable Kit. For bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks. LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. It should be limited to a maximum of 500 V in high pot applications.
- Attributes
- Applications
Attributes
General Information
Item NameRepairable Kit
Trade NameHenkel
SeriesLOC-384-KT
General Features
Shelf Life9 Months
Storage Temperature2 to 8 °C
Design & Construction
ColorWhite
Cure TypeRoom Temperature
FormPaste
Performance Details
Shear Strength750 psi
Tensile Strength1800 psi
Full Cure Time4 - 24 hr at 20 °C
Chemical Properties
CompositionModified Acrylic
Specific Gravity1.64
Viscosity300000 cP
VOC266g/L
Electrical Properties
Dielectric Strength26.7kV/mm
Physical Properties
Container Size25mL
Container TypeSyringe
Odor/ScentMild
Elongation0.9%
Environmental Condition
Temperature Rating-40 to 250 °F
Applications
- For Bonding Transformers, Transistors and Other Heat Generating Electronic Components to Printed Circuit Board Assemblies or Heat Sinks