MFR #:3762LM
EIS #:PH11-3762LM
Series #:3762LM
MFR #:3762LM
EIS #:PH11-3762LM
Series #:3762LM
3M hot melt adhesives are heat applied, 100% solids adhesives. They are fast setting thermoplastic adhesives with good hot tack and low to medium viscosity. 3M hot melt adhesives bond to a wide variety of substrates such as corrugated, beadboard, repacking chipboard, recouperage, wood and many other lightweight materials. It's designed for general purpose applications as well as manual and corrugated carton sealing and general packaging. - 3M hot melt adhesive 3762 is a 100% is an economical, fast-setting resin solid hot melt adhesive. When heated to its specified melt point this adhesive forms an aggressive hot tack that bonds to handling strength in seconds to help maintain high-tempo productivity.
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3M hot melt adhesives are heat applied, 100% solids adhesives. They are fast setting thermoplastic adhesives with good hot tack and low to medium viscosity. 3M hot melt adhesives bond to a wide variety of substrates such as corrugated, beadboard, repacking chipboard, recouperage, wood and many other lightweight materials. It's designed for general purpose applications as well as manual and corrugated carton sealing and general packaging. - 3M hot melt adhesive 3762 is a 100% is an economical, fast-setting resin solid hot melt adhesive. When heated to its specified melt point this adhesive forms an aggressive hot tack that bonds to handling strength in seconds to help maintain high-tempo productivity.
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Size: 3 Inch L x 1 Inch W | EIS Part #: 3MA3762PGLM | $ / US pound Pack: 22 lb/Case |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameHot Melt Adhesive
Series3762LM
General Features
Shelf Life24 Months
StandardsFDA 21 CFR 175.105 Certified
Storage Temperature120 °F
Design & Construction
ColorLight Amber
Performance Details
Shear Strength480 psi
Heat ResistanceYes
Open Time25 sec
Chemical Properties
CompositionEthylene Vinyl Acetate
Viscosity4000 cP
Electrical Properties
UL RatingUL94 V-2
Physical Properties
Odor/ScentMild Resinous
Supporting Information
Applicable MaterialsPaper and Cardboard
Application MethodHandheld process
Features
- Aggressive hot tack rapidly achieves handling strength for packaging and other applications
- Medium open time allows for positioning and fit adjustment
- Securely bonds difficult to seal substrates such as lightly waxed surfaces
- Virtually invisible when bonded, eliminating unattractive mechanical fasteners and tape products
- Bonds to corrugated or paperboard cartons, wood, particle board, chipboard and cushioning foams
- Easy-to-use
- Fast setting adhesive obtains strength in seconds
- Low melt adhesives are designed for low temperature application and heat sensitive substrates
- Quick grab for instant adhesion that cools to a tack free solid
- 100% solids, no VOCs
- 6 piw peel strength
Applications
- For General Packaging, Recouperage, Repacking Chipboard, Point-Of-Purchase, Beadboard, Displays, Woodworking, Trade Exhibits, Foam Inserts, Craft Applications, Bonding Waxed Surfaces