MFR #:0210-0001
EIS #:0210-0001-ZES
Series #:RC 101
MFR #:0210-0001
EIS #:0210-0001-ZES
Series #:RC 101
Low Stock
Min Qty:1
|Qty Increment:1
Pack:12 Liters/Box
Based on the MPC Technology, VIGON RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies. - The medium does not contain any ingredients, which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts.
$261.00 / Box
Pack: 12 Liters/Box
Min Qty:1
|Qty Increment:1
Pack:12 Liters/Box
Based on the MPC Technology, VIGON RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies. - The medium does not contain any ingredients, which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts.
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Container Size: 1L | EIS Part #: 0210-0001-ZES | $ / Box Pack: 12 Liters/Box |
- Attributes
- Applications
- Features
- Documents
Attributes
General Information
Item NameFlux Remover
Trade NameVigon
SeriesRC 101
General Features
StandardsREACH, RoHS, WEEE Compliant
Net Weight1 L
Shelf Life60 Months
Storage Temperature5 to 30 C
Design & Construction
FormLiquid
Performance Details
RemovesLow Solid Flux Residues, Rosin Based Flux Residues, Water Soluble Flux Residues, Synthetic Fluxes, Fumigation Contamination
Vapor PressureApprox. 11 mbar at 20 C
Technical Details
Boiling Point>99 to 212 C
Chemical Properties
pH Rating10.8 (10g/L H2O)
Physical Properties
Container Size1L
Container TypeBottle
Density0.99 g/cm3 at 20 C
Environmental Condition
Temperature Rating20 to 50 C
Supporting Information
Applicable MaterialsAluminum, epoxy
For Use WithReflow ovens, wave soldering systems, conveyor fingers
Use WithManual and automated cleaning equipment
Solubility In WaterSoluble
Applications
- For Reflow and Wave Solder Equipments
Features
- Has no flash point and therefore can be applied directly onto cold or warm surfaces
- Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided
- Has a mild formulation with a low alkaline pH-value. Therefore, no special labeling is required
- Excellent material compatibility with aluminum and epoxy surfaces
- The cleaning agent is also suitable for the pre-cleaning of condensation traps
- Has little odor
- Reduced cleaning agent consumption compared to IPA
- Its no flashpoint formulation significantly increases the operator's safety
- Biodegradable
- Formulated free of halogenated compounds and is very environmentally friendly and considered a non-hazardous material
- No special precaution for handling is required