MFR #:Dolphon® CB-1078
EIS #:PH21-Dolphon CB-1078
MFR #:Dolphon® CB-1078
EIS #:PH21-Dolphon CB-1078
Von Roll/John C Dolph Dolphon® CB-1078 Epoxy Potting And Casting Resin, Epoxy Base Type, Room Temperature Cure Type, 400 V/Mil Dielectric Strength, >104 °C/>220 °F Flash Point, 17000 psi Flexural Strength, 75 - 80 Shore D Hardness, 100 Weight Mixing Ratio, Epoxy Mild Odor/Scent, 1.09 Specific Gravity, Class B Temperature Rating, 9000 psi Tensile Strength, 4.2 BTU/HR/ft²/Inch/°F Thermal Conductivity, 18000 - 28200 cps At 77 °F/25 °C Viscosity. - CB-1078 is a general purpose, high thermal conductivity, black epoxy casting and potting resin for use in all types of electrical and electronic assemblies.
$19.83
- $29.80
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Von Roll/John C Dolph Dolphon® CB-1078 Epoxy Potting And Casting Resin, Epoxy Base Type, Room Temperature Cure Type, 400 V/Mil Dielectric Strength, >104 °C/>220 °F Flash Point, 17000 psi Flexural Strength, 75 - 80 Shore D Hardness, 100 Weight Mixing Ratio, Epoxy Mild Odor/Scent, 1.09 Specific Gravity, Class B Temperature Rating, 9000 psi Tensile Strength, 4.2 BTU/HR/ft²/Inch/°F Thermal Conductivity, 18000 - 28200 cps At 77 °F/25 °C Viscosity. - CB-1078 is a general purpose, high thermal conductivity, black epoxy casting and potting resin for use in all types of electrical and electronic assemblies.
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Container Size: 60 lb | EIS Part #: DOLCB107860LB | $ / US pound | ||
Container Size: 12 lb | EIS Part #: DOLCB107812LB | $ / US pound |
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameEpoxy Potting and Casting Resin
Trade NameDolphon®
SeriesDolphon® CB-1078
Design & Construction
Base TypeEpoxy
ColorBlack
Cure TypeRoom Temperature
FormLiquid
Performance Details
Tensile Strength9000 psi
Flexural Strength17000 psi
Technical Details
Flash Point104 °C
Chemical Properties
Mixing Ratio100 Weight
Specific Gravity1.09
Viscosity18000 cP
Electrical Properties
Dielectric Strength400 V/mil
Physical Properties
Odor/ScentEpoxy Mild
Hardness75 - 80 Shore D
Features
- Room temperature cure and heat curing reactors available
- Excellent thermal conductivity
- Superior electrical properties
- Low shrinkage
- Superior water and chemical resistance
- Glossy jet black sheen with CB-1078-B
- Good impact resistance
- 7.5 x 10^14 ohm surface resistivity
- 8.0 x 10^15 Ohm-cm volume resistivity
- 4.596 at 23 °C, 60 Hz dielectric constant
- 0.0207 at 23 °C, 60 Hz dissipation factor
- 19500 psi compressive strength
- 0.10% at 25 °C water absorption
- 17 x 10^-6 Inch/Inch/°C (ASTM D-696 ) coefficient of linear thermal expansion
- 0.2% shrinkage
- Flash Point: >104 °C/>220 °F
- Viscosity: 18000 - 28200 cps at 77 °F/25 °C
- Temperature Rating: Class B
- Thermal Conductivity: 4.2 BTU/HR/ft²/Inch/°F
- Viscosity: 18000 - 28200 cP
Applications
- Relays and Coils
- Battery Chargers
- Sensors
- Capacitors
- Electronic Ballasts
- Motors
- Electronic Assemblies
- Hybrid Circuits
- Transformers