MFR #:E-5302
EIS #:PH11-E-5302
Series #:E-5302
MFR #:E-5302
EIS #:PH11-E-5302
Series #:E-5302
Epoxylite E 5302 hi-temp epoxy is a heat-cured, two-component system consisting of a viscous liquid resin and a finely divided powder hardener. Maintains excellent electrical and physical properties to at least 260 °C / 500 °F. Bonding and sealing of electrical and electronic components requiring resistance to high temperatures. - This product withstands temperatures in excess of 316 °C / 600 °F for short periods. Excellent adhesion to metals, ceramics and most plastics. Resistant to acids, alkalis and solvents.
$329.78
- $1,607.04
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Epoxylite E 5302 hi-temp epoxy is a heat-cured, two-component system consisting of a viscous liquid resin and a finely divided powder hardener. Maintains excellent electrical and physical properties to at least 260 °C / 500 °F. Bonding and sealing of electrical and electronic components requiring resistance to high temperatures. - This product withstands temperatures in excess of 316 °C / 600 °F for short periods. Excellent adhesion to metals, ceramics and most plastics. Resistant to acids, alkalis and solvents.
Product Options
Showing 3 out of 3 options
Container Size: 1 pt | EIS Part #: EPO5302PK | $ / Kit | ||
Container Size: 100g | EIS Part #: EPO5302100GM | $ / Kit | ||
Container Size: 1 qt | EIS Part #: E5302Q | $ / Quart US l |
- Attributes
- Applications
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Attributes
General Information
Item NameEpoxy Adhesive
Trade NameEpoxylite®
SeriesE-5302
General Features
Shelf Life6 Months
Storage Temperature25 °C
TypeHigh Temperature
Design & Construction
Cure TypeHeat Cure
Form - Part-ALiquid
Form - Part-BSolid
Chemical Properties
Composition - Part-AModified Epoxy Resin
Composition - Part-BModified Aromatic Anhydride
Viscosity - Part-A20000 - 40000 cP
Physical Properties
Container TypeKit
Hardness90 Shore D
Applications
- For Bonding and Sealing of Electrical and Electronic Components Requiring Resistance to High Temperatures