
MFR #:2216
EIS #:PH11-22161
Series #:2216
MFR #:2216
EIS #:PH11-22161
Series #:2216
3M Scotch-Weld epoxy adhesive 2216 is a flexible, 1-part epoxy adhesive that cures at room temperature. It provides a high strength bond with both high shear and peel strength while remaining highly flexible, making it ideal for applications where vibration and thermal expansion and contraction are common. - 1-part epoxy adhesive also withstands very cold temperatures without overly embrittling. Maintains a strong bond under expansion, contraction and limited movement while retaining good strength after environmental aging.
$357.50
- $358.51
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3M Scotch-Weld epoxy adhesive 2216 is a flexible, 1-part epoxy adhesive that cures at room temperature. It provides a high strength bond with both high shear and peel strength while remaining highly flexible, making it ideal for applications where vibration and thermal expansion and contraction are common. - 1-part epoxy adhesive also withstands very cold temperatures without overly embrittling. Maintains a strong bond under expansion, contraction and limited movement while retaining good strength after environmental aging.
Product Options
Showing 2 out of 2 options
Type: Part B | Container Size: 5 gal | Container Type: Pail | EIS Part #: 3MA2216BG5G | $ / US gallon Pack: 1/Case | ||
Type: Part A | Container Size: 5 gal | Container Type: Pail | EIS Part #: 3MA2216AG5G | $ / US gallon Pack: 1/Case |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameEpoxy Adhesive
Trade NameScotch-Weld™
Series2216
General Features
Shelf Life24 Months
StandardsOSHA Approved, 29 CFR 1910.1200 Certified
Storage Temperature72 °F
Design & Construction
ColorGray
Cure TypeRoom Temperature
FormLiquid
Chemical Properties
VOCSee SDS
Physical Properties
Container Size5 gal
Container TypePail
Hardness50 - 65 Shore D
Features
- Very flexible bond is resistant to extreme shock, vibration and flexing, making it ideal for potting and applications in the transportation industries
- Excellent for cryogenic bonding applications or adhering substrates that will be exposed to extreme cold
- Medium viscosity help minimize running, dripping or migration while also self-leveling
- Versatile bonding agent will adhered a wide variety of similar and dissimilar substrates, including metals and masonry
- Can be heat cured to reduce curing times from 7 days to as little as 30 min
Applications
- For Bonding, Gluing, Joining, Attaching, Assembling, Encapsulating, Potting and Sealing, General Industrial, Sporting Goods, Solar Energy, Wind Energy, Electronics, Military, Transportation and Aerospace