Dow Corning one-part moisture cure adhesives are generally cured at room temperature and in an environment of 30 - 80% relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. These adhesives are not typically used in highly confined spaces or where a deep section cure is required as they generally cure from the exposed surface inward at a rate of 0.25 Inch per seven days. Cure progresses from the outer exposed surface and is dependent on the moisture in the air. - Greater than 90% of full physical properties should be varies according to product. Faster attained within 24 to 72 hr and typical properties, continued Property Unit Value Dielectric Constant at 1MHz (JIS K 6249) - 3.1 Dissipation Factor at 1MHz (JIS K 6249) - 0.0004 UL Flammability Classification NA 94 V-0 manufacturing throughput can be achieved since the adhesive and component can be handled in much shorter times of about 10 to 120 min, depending on the adhesive selected and the amount applied.