Henkel BERGQUIST® GAP PAD® TGP 12000ULM 8 In X 8 In X 0.100 In, MFR ID 2722290
- EIS #BERG2722290
$779.02 / Sheet
Available to Order
Min QTY1QTY Increment1
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BERGQUIST® GAP PAD® TGP 12000ULM is an extremely soft, ultra low modulus (ULM) resin material with a unique filler package, which provides excellent thermal performance at low pressures. The flexibility of the material easily conforms to rough or irregular surfaces, allowing exceptional wet-out characteristics at the interface, while protective liners on both sides allow for easy application.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: 55
Sensitive to Heat/Frost: Sensitive to Heat,Sensitive to Frost
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: 55
Sensitive to Heat/Frost: Sensitive to Heat,Sensitive to Frost
Features
- Thermal conductivity: 12 W/m-K
- Exceptional thermal performance at low pressures
- Ultra-low modulus allows for excellent adhesion to rough surfaces
- Supplied with protective liners for ease of use
- High compliance
- Extremely soft, electrically insulating pad with exceptional thermal conductivity
Specifications
Thermal conductivity: 12.0 W/mK
Operating temperature: -60.0 °C - 200.0 °C
General Information
| Item Name | BERGQUIST® GAP PAD® TGP 12000ULM |
General Features
| Shelf Life | 6 MON |
Physical Properties
| Container Size | 8 in x 8 in x 0.100 in |
| Container Type | Sheet |
| Pad Type | Gap Pad |
Supporting Information
| Use With | Thermal management, gap pads, Thermal management |
Documents
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