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Loctite 3627 Chipbonder® One-Part Surface Mount Adhesive

The image shown is representative of the product family and may not specifically be the individual item.  Loctite HYDX-20 is a high activity, flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables …

MFR #:LOC-3627

EIS #:PH11-LOC-3627

Series #:LOC-3627

MFR #:LOC-3627

EIS #:PH11-LOC-3627

Series #:LOC-3627

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Loctite 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - The product is also suitable for stencil print applications. Loctite 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
$114.05
 - $560.57
Select from the options below
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Loctite 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - The product is also suitable for stencil print applications. Loctite 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.

Product Options

Showing 2 out of 2 options
The image shown is representative of the product family and may not specifically be the individual item.
Container Size
300mL
Container Type
Semco Cartridge
EIS Part #
LOC37679
$ / Cartridge
Pack2/Carton
The image shown is representative of the product family and may not specifically be the individual item.  Loctite HYDX-20 is a high activity, flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables …
Container Size
10mL
Container Type
Iwashita Syringe
EIS Part #
LOC37671
$ / Piece

Attributes

General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®
SeriesLOC-3627
General Features
Storage Temperature2 to 8 °C
TypeOne-Part
Design & Construction
ColorRed
Cure TypeHeat Cure
FormLiquid, Paste
Performance Details
Full Cure Time90 sec at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity1.353
Viscosity2 - 5 Pa at 25 °C
Physical Properties
Density1.16g/cc
Odor/ScentCharacteristic