
MFR #:247791
EIS #:LOC26652
Series #:LOC-3614
MFR #:247791
EIS #:LOC26652
Series #:LOC-3614
Out of Stock
Min Qty:1
|Qty Increment:1
Loctite 3614 is single part epoxy adhesive which cures rapidly on exposure to heat. It is designed to give excellent dot size and shape control when applied using Loctite Varidot stencil printing technology. LOCTITE® 3614 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium print speeds, high dot profile, high wet strength and good electrical characteristics are required.
$1,896.01 / each
Min Qty:1
|Qty Increment:1
Loctite 3614 is single part epoxy adhesive which cures rapidly on exposure to heat. It is designed to give excellent dot size and shape control when applied using Loctite Varidot stencil printing technology. LOCTITE® 3614 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium print speeds, high dot profile, high wet strength and good electrical characteristics are required.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®, Varidot™
SeriesLOC-3614
General Features
Shelf Life9 Months
Storage Temperature2 to 8 °C
TypeOne-Part
Design & Construction
ColorRed
Cure TypeHeat Cure
FormLiquid
Performance Details
Full Cure Time60 sec at 150 °C
Shear Strength2100 - 2900 psi at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity1.36
Electrical Properties
Dielectric StrengthSee TDS
Physical Properties
Container Size300mL
Container TypeCartridge
Supporting Information
Application MethodStencil Print
Features
- One-component requires no mixing and is heat cure
- Bonding of surface mounted devices to printed circuit boards prior to wave soldering
- Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics are required
- Peaked dot profile
Applications
- For Small Parts Bonding