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Henkel's Technomelt brand encompasses low-pressure molding compounds which are an environmentally friendly alternative to traditional potting and injection molding encapsulation techniques. The polyamide hot melt material known as Technomelt quickly encapsulates exposed circuitry to form the outer shell of the device, thus delivering a self-contained integrated assembly. The process is fast, simple, cost-effective and perfect for delicate circuitry as the application pressure within the mold cavity is an incredibly low 20 to 500psi.