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Loctite 3607 Chipbonder® Varidot™ Pin Transfer Stencil Surface Mount Adhesive, 300mL Cartridge, Red

The image shown is representative of the product family and may not specifically be the individual item.  Loctite HYDX-20 is a high activity, flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables …

MFR #:88135

EIS #:LOC18380

Series #:LOC-3607

MFR #:88135

EIS #:LOC18380

Series #:LOC-3607

Out of Stock

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
more info
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Loctite 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive. LOCTITE® 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive.
$1,884.93 / Piece

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
more info
0
0
Loctite 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive. LOCTITE® 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive.

Attributes

General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®, Varidot™
SeriesLOC-3607
General Features
Shelf Life4 Months
Storage Temperature2 to 8 °C
TypePin Transfer Stencil
Design & Construction
ColorRed
Cure TypeHeat Cure
FormSemi Solid/Gel
Performance Details
Shear Strength3625 psi at 150 °C
Full Cure Time150 - 180 sec at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity1.2
Electrical Properties
Dielectric StrengthSee TDS
Physical Properties
Container Size300mL
Container TypeCartridge
Supporting Information
Application MethodPin Transfer